Semiconductor package and method of manufacture

ABSTRACT

A method of manufacture for a semiconductor package includes; forming a molding member on side surfaces of the semiconductor chips, using an adhesive to attach a carrier substrate to upper surfaces of the molding member and the semiconductor chips, using a first blade having a first blade-width to cut away selected portions of the carrier substrate and portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between adjacent ones of semiconductor chips, using a second blade having a second blade-width narrower than the first blade-width to cut through a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including a semiconductor chip supported by a cut portion of the carrier substrate and bonding the package structure to an upper surface of a package substrate.

CROSS-RELATED APPLICATION

This is a Continuation of U.S. Application No. 17/177,725, filed Feb.17, 2021, and a claim of priority is made to Korean Patent ApplicationNo. 10-2020-0113839 filed on Sep. 7, 2020, in the Korean IntellectualProperty Office (KIPO), the subject matter of which is herebyincorporated by reference.

BACKGROUND 1. Field

Embodiments of the inventive concept relate generally to semiconductorpackages and methods for manufacturing the same. More particularly,embodiments of the inventive concept relate to flip-chip typesemiconductor packages and methods for manufacturing the same.

2. Description of the Related Art

Flip-chip type semiconductor packages generally include a packagesubstrate, a semiconductor chip, and conductive bumps interposed betweenthe package substrate and the semiconductor chip. The conductive bumpsmay be used to electrically connect the semiconductor chip with aconductive on the package substrate using a reflow process.

However, the semiconductor chip and the package substrate may beconstructed of various and different materials having differentcoefficients of thermal expansion. Accordingly, there is some risk thatthermal stress applied to the semiconductor chip, an interposer and/orthe package substrate may cause material(s) warpage.

SUMMARY

Embodiments of the inventive concept provide semiconductor packages moreresistant to thermal stress potentially causing material(s) warpage.Embodiments of the inventive concept also provide methods of manufacturefor such semiconductor packages.

In some embodiments, a semiconductor package may include; a packagesubstrate, an interposer disposed on an upper surface of the packagesubstrate, a first semiconductor chip and a stacked plurality of secondsemiconductor chips disposed on an upper surface of the interposer, anda molding member around side surfaces of the first semiconductor chipand the stacked plurality of second semiconductor chips. Here, themolding member may include a protruding sidewall including an upper endthat extends horizontally outward and is vertically offset below anupper surface of the molding member by a first distance, a lower endthat extends horizontally outward and is vertically offset above a lowersurface of the molding member by a second distance, and an outer sidesurface vertically extending between the upper end and the lower end,wherein an upper protruding width of the upper end is greater than alower protruding width of the lower end.

In some embodiments, a semiconductor package may include; a packagesubstrate, an interposer disposed on an upper surface of the packagesubstrate, a first semiconductor chip disposed on an upper surface ofthe interposer, a second semiconductor chip disposed on the uppersurface of the interposer; and a molding member includes an uppersurface, an upper portion, a lower portion and a protruding sidewall,wherein the molding member is molded around side surfaces of the firstsemiconductor chip and the second semiconductor chip. The protrudingsidewall may include an upper end vertically offset below the uppersurface of the molding member, and have a width greater than a width ofthe upper portion of the molding member.

In some embodiments, a method of manufacture for a semiconductor packagemay include; arranging a first semiconductor chip, a first stackedplurality of second semiconductor chips and a second stacked pluralityof second semiconductor chips on an upper surface of an interposer,forming a molding member on side surfaces of the first semiconductorchips, the first stacked plurality of second semiconductor chips and thesecond stacked plurality of second semiconductor chips, using anadhesive to attach a carrier substrate to an upper surface of themolding member, an upper surface of the first semiconductor chip, anupper surface of the first stacked plurality of second semiconductorchips and an upper surface of the second stacked plurality of secondsemiconductor chips, using a first blade having a first blade-width tocut away selected portions of the carrier substrate and cut awayportions of the adhesive underlying the selected portions of the carriersubstrate, and using the first blade to partially cut into an uppersurface of the molding member to form a first cutting groove, whereinthe selected portions of the carrier substrate are dispose aboveportions of the molding member between the first stacked plurality ofsecond semiconductor chips and the second stacked plurality of secondsemiconductor chips, using a second blade having a second blade-widthnarrower than the first blade-width to cut through the interposer and atleast partially into a lower surface of the molding member to form asecond cutting groove, wherein a combination of the first cutting grooveand the second cutting groove separate a package structure including acut portion of the interposer, the first semiconductor chip and thefirst stacked plurality of second semiconductor chips, collectivelysupported by a cut portion of the carrier substrate and bonding thepackage structure to an upper surface of a package substrate.

In some embodiments, a method of manufacture for a semiconductor packagemay include; forming a molding member on side surfaces of thesemiconductor chips, using an adhesive to attach a carrier substrate toupper surfaces of the molding member and the semiconductor chips, usinga first blade having a first blade-width to cut away selected portionsof the carrier substrate and portions of the adhesive underlying theselected portions of the carrier substrate, and using the first blade topartially cut into an upper surface of the molding member to form afirst cutting groove, wherein the selected portions of the carriersubstrate are dispose above portions of the molding member betweenadjacent ones of semiconductor chips, using a second blade having asecond blade-width narrower than the first blade-width to cut through alower surface of the molding member to form a second cutting groove,wherein a combination of the first cutting groove and the second cuttinggroove separate a package structure including a semiconductor chipsupported by a cut portion of the carrier substrate, and bonding thepackage structure to an upper surface of a package substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The inventive concept may be more clearly understood upon considerationof certain embodiments illustrated in the accompanying drawings, inwhich:

FIG. 1 is a cross-sectional view illustrating a semiconductor packageaccording to embodiments of the inventive concept;

FIG. 2 is an enlarged, cross-sectional view of portion “A” in FIG. 1 ;

FIG. 3 is a cross-sectional view taken along line B-B′ in FIG. 1 ;

FIGS. 4, 5, 6 and 7 (collectively, “FIGS. 4 to 7 ”) are relatedcross-sectional views illustrating in one example a method ofmanufacture for the semiconductor package of FIG. 1 ;

FIG. 8 is a cross-sectional view illustrating a semiconductor packageaccording to embodiments of the inventive concept;

FIG. 9 is an enlarged, cross-sectional view of portion “C” in FIG. 8 ;

FIG. 10 is a cross-sectional view taken along line D-D′ in FIG. 8 ;

FIGS. 11, 12, 13, 14 and 15 (collectively, “FIGS. 11 to 15 ”) arerelated cross-sectional views illustrating in one example a method ofmanufacture for the semiconductor package of FIG. 8 ;

FIG. 16 is a cross-sectional view illustrating a semiconductor packageaccording to embodiments of the inventive concept;

FIG. 17 is an enlarged, cross-sectional view of portion “E” in FIG. 16 ;

FIG. 18 is a cross-sectional view taken along line F-F′ in FIG. 16 ; and

FIGS. 19, 20, 21, 22 and 23 (collectively, “FIGS. 19 to 23 ”) arerelated cross-sectional views illustrating in one example a method ofmanufacture for the semiconductor package of FIG. 16 .

DETAILED DESCRIPTION

Throughout the written description and drawings, like reference numbersand labels are used to denote like or similar elements, components,steps and/or features. Throughout the written description, certaingeometric terms may be used to highlight relative relationships betweenelements, components and/or features with respect to certain embodimentsof the inventive concept. Those skilled in the art will recognize thatsuch geometric terms are relative in nature, arbitrary in descriptiverelationship(s) and/or directed to aspect(s) of the illustratedembodiments. Geometric terms may include, for example: height/width;vertical/horizontal; top/bottom; higher/lower; closer/farther;thicker/thinner; proximate/distant; above/below; under/over;upper/lower; center/side; surrounding; overlay/underlay; etc.

FIG. 1 is a cross-sectional view illustrating a semiconductor package100 according to embodiments of the inventive concept. FIG. 2 is anenlarged, cross-sectional view illustrating portion “A” in FIG. 1 , andFIG. 3 is a cross-sectional view taken along line B-B′ in FIG. 1 .

Referring to FIGS. 1, 2 and 3 , the semiconductor package 100 mayinclude a package substrate 110, a semiconductor chip 120, conductivebumps 130, a molding member 140, an underfilling layer 150 and externalterminals 160.

The package substrate 110 may include an insulation substrate and aconductive pattern, wherein the conductive pattern may be arranged uponand/or within the insulation substrate. Here, the conductive pattern mayinclude an upper conductive pattern associated with (e.g., disposed onand/or exposed by) an upper surface of the package substrate 110, and/ora lower conductive pattern associated with a lower surface of thepackage substrate 110.

The semiconductor chip 120 may be disposed (e.g., arranged over and/ormounted on) the upper (or active) surface of the package substrate 110.Electrically conductive pads 112 may be arranged on a lower surface ofthe semiconductor chip 120 to face the upper surface of the packagesubstrate 110 when the semiconductor chip 120 is disposed on the packagesubstrate 110.

With the exemplary configuration of FIG. 1 in mind, the principalupper/lower surfaces of the package substrate 110, as well as theprincipal upper/lower surfaces of the semiconductor chip 120, may beunderstood as being laterally (or horizontally) oriented according to afirst horizontal direction and a second horizontal directions (e.g., anX direction and a Y direction). Hence, the semiconductor chip 120 may beunderstood as being vertically disposed on the package substrate 110according to a vertical direction (e.g., a Z direction) substantiallyorthogonal to the first and second horizontal directions.

The conductive bumps 130 may be respectively disposed on the lowersurface of the semiconductor 120 (e.g., on or over the pads 112), suchthat the conductive bumps 120 are interposed between the packagesubstrate 110 and the semiconductor chip 120. At least some of theconductive bumps 130 may be configured to electrically connect the upperconductive pattern of the package substrate 110 with the pads 112. Thus,in operational effect, various conductive pattern(s) and circuitry ofthe semiconductor chip 120 may be electrically connected with the upperconductive pattern of the package substrate 110 via the conductive bumps130.

The underfilling layer 150 may be interposed between the packagesubstrate 110 and the semiconductor chip 120. Here, the underfillinglayer 150 may substantially surround the respective conductive bumps130.

The external terminals 160 (e.g., solder balls or similar conductiveelements) may be disposed on the lower surface of the package substrate110 in electrical contact with the lower conductive pattern disposed onthe lower surface of the package substrate 110.

The molding member 140 may mold around (wholly or in part) the sidesurface(s) of the semiconductor chip 120.

In some embodiments, the molding member 140 (e.g., an epoxy moldingcompound or EMC) may be molded around to substantially surround the sidesurfaces of the semiconductor chip 120. In some embodiments, the moldingmember 140 may not cover any portion of the upper surface of thesemiconductor chip 120, but in other embodiments, the molding member 140may cover some or all of the upper surface of the semiconductor chip120.

According to certain embodiments of the inventive concept, the moldingmember 140 may include a protruding sidewall portion that extendshorizontally and outwardly (hereafter, the protruding sidewall 170). Inthis context, the term “outwardly” denotes a direction away from avertical center axis of the semiconductor package. Here, the protrudingsidewall 170 may be a materially integral part (or portion) of themolding member 140 produced by a conventionally understood a moldingprocess. Once formed (as described in detail hereafter) the protrudingsidewall may include an upper portion above the protruding sidewall 170and a lower portion below the protruding sidewall portion. Each of theupper portion of the molding member 140, the lower portion of themolding member 140 and the protruding sidewall portion of the moldingmember 140 may have a corresponding width measured in a same horizontaldirection from (e.g.,) a proximate vertical sidewall of a semiconductordevice. Thus, the protruding sidewall 170 may be understood ashorizontally protruding (or extending) farther from the center axis ofthe semiconductor package than at least one of the upper portion of themolding member 140 and the lower portion of the molding member 140.

The protruding sidewall 170 of the molding member 140 may be furtherunderstood as having an upper end 172, a lower end 174 and an outer sidesurface 176. Here, the upper end 172 and the lower end 174 may eachoutwardly and horizontally extend away from the from the semiconductorchip 120. The outer side surface 176 of the protruding sidewall of themolding member 140 may extend between the upper end 172 and the lowerend 174. Thus, the outer side surface 176 may form a substantiallyvertical surface.

In some embodiments of the inventive concept, the molding member 140including the protruding sidewall 170 may substantially surround all ofthe side surfaces of the semiconductor chip 120. (This feature isillustrated in FIG. 3 ). Accordingly, the molding member 140 includingthe protruding sidewall 170 may have a rectangular frame shapesubstantially surrounding the semiconductor chip 120.

As illustrated in FIG. 2 , the upper end 172 of the protruding sidewall170 may be vertically offset below an upper surface of the moldingmember 140 (which may, in some embodiments, be coplanar with the uppersurface of the semiconductor chip 120). In some embodiments, thevertical offset distance (L1) between the upper surface of the moldingmember 140 and the upper end 172 of the protruding sidewall 170 will beat least about 20 µm, however the scope of the inventive concept is notlimited thereto.

Here, the lower end 174 of the protruding sidewall 170 horizontally andoutwardly extends away from the semiconductor chip 120 at a firstvertical height substantially coplanar with (or defined by) a lowersurface of the molding member 140 which is coplanar with the lowersurface of the semiconductor chip 120.

FIGS. 4 to 7 are related cross-sectional views illustrating in oneexample a method of manufacture for the semiconductor package of FIG. 1.

Referring to FIG. 4 , the molding member 140 may be molded around(wholly or in part) multiple semiconductor chips 120. In particularly,the molding member 140 may be formed between the side surfaces ofrespectively adjacent semiconductor chips 120. In this manner, themolding member 140 may substantially surround at least the side surfacesof the semiconductor chips 120.

In this regard, a molding process used to mold the molding ember 140around the semiconductor chips 120 may be performed as part ofmechanically supporting the semiconductor chips 120 during fabricationusing a supporting substrate. After the molding process forming themolding member 140 is complete, the supporting substrate may be removedfrom the semiconductor chips 120. Then, the conductive bumps 130 may bearranged on the lower surface of each of the semiconductor chips 120.Alternately, the molding process forming the molding member 140 may beperformed after arranging the conductive bumps 130 on the lower surfaceof the semiconductor chips 120.

As illustrated in FIG. 4 , a carrier substrate 200 may be attached tothe upper surfaces of the semiconductor chips 120 using an adhesive 210.With this configuration, the semiconductor chips 120 may be supported bythe carrier substrate 200. Here, it should be noted that manyconventionally available carrier substrates may include one or morematerials such as glass, epoxy, a semiconductor material, etc.

Referring to FIG. 5 , selected portions of the carrier substrate 200,along with portions of the adhesive 210 underlying these selectedportions of the carrier substrate 200) may be removed (or cut away)using a first blade B1. Here, the selected portions of the carriersubstrate 200 removed by application of the first blade B1 may beportions of the carrier substrate 200 respectively overlaying portionsof the molding member 140 disposed between adjacent ones of thesemiconductor chips 120.

In this regard, the first blade B1 may penetrate from an upper surfaceof the carrier substrate 200 to a lower surface of the adhesive 210,thereby forming a vertically-aligned first cutting groove 202 throughthe carrier substrate 200 and the adhesive 210. When the carriersubstrate 200 is a glass substrate, for example, the first blade B1 maybe selected (e.g., from a variety of conventionally available sawblades) according to cutting characteristics optimally applied to thecutting of the glass substrate. In this regard, the generation of anedge burr or other damage to the glass substrate may be minimized orprevented by use of an appropriate blade selected as the first blade B1in relation to the constituent material(s) of the carrier substrate 200.

According to certain embodiments of the inventive concept, duringapplication of the first blade B1 to fully remove the selected portionsof the carrier substrate 200 and the corresponding portions of theadhesive 210, the first blade B1 may partially penetrate into the uppersurface of the molding member 140. Here, it should be noted thatstopping the descending first blade B1 before fully removing theadhesive 210 underlaying the selected portions of the carrier substrate200 may result in adhesive residue adhering to, and possibly cloggingthe first blade B1. In order to prevent clogging, a first cuttingprocess performed with the first blade B1 should not be stopped part-waythrough the adhesive 210. Thus, by allowing the first blade B1 topartially penetrate into the upper surface of the molding member 140,the selected portions of the carrier substrate 200 along withcorresponding portions of the adhesive 210 may be fully and cleanlyremoved. As a result of this approach, a first width of the firstcutting groove 202 may be particularly defined by appropriate selectionof the first blade B1 having a first blade-width substantially equal tothe desired first width.

Referring to FIG. 6 , a second cutting process using a second blade B2may be applied to selected portions of the molding member 140 betweenadjacent ones of the semiconductor chips 120. Here, the second blade B2may be selected according to optimal cutting characteristics relative tothe material(s) forming the molding member 140, and may be characterizedby a second blade-width, different from (e.g., more narrow than) thefirst blade-width.

In its operational application, the second blade B2 may pass through thethickness of the molding member 140 to form a vertically-aligned, secondcutting groove 204. Here, in some embodiments, because the secondblade-width of the second blade B2 is narrower than the firstblade-width of the first blade B1, the second cutting groove 204 will benarrower than the first cutting groove 202. Using this dual cuttingapproach as one example, the molding member 140 including the protrudingsidewall 170 and described above in relation to FIGS. 1, 2 and 3 may beformed.

Thus, the second cutting groove 204 may pass into the first cuttinggroove 202 to effectively divide adjacent semiconductor chips 120 onefrom the other. Yet, the divided semiconductor chips 120 remain wellsupported by the carrier substrate 200. Alternately, the second cuttingprocess using the second blade B2 may be performed before the firstcutting process using the first blade B1.

Referring to FIG. 7 , the semiconductor chip 120 still supported by thecarrier substrate 200, may be flipped and mounted (e.g., bonded) to thepackage substrate 110 via the conductive bumps 130. That is, once thesupported semiconductor chip 120 is flipped, the conductive bumps 130 —now on the lower surface of the semiconductor chip 120 — may beelectrically connected to the upper conductive pattern on the uppersurface of the package substrate 110. In this regard, for example, areflow process may be applied to electrically connect the conductivebumps 130 to the upper conductive pattern on the upper surface of thepackage substrate 110. During the reflow process, the semiconductor chip120 may be compressed to (e.g., mounted on) the package substrate 110.

As noted above, some material(s) warpage may occur during the reflowprocess, as conventionally applied to a semiconductor chip. However,according to embodiments of the inventive concept, the carrier substrate200 supporting the semiconductor chip 120 has the effect of suppressingor preventing warpage of the semiconductor chip 120. Furthermore, therisk of warpage in the semiconductor chip 120 may be prospectivelyguarded against by appropriately selecting a thickness of the carriersubstrate 200 and/or a thickness of the adhesive 210.

Here, it should be noted that the carrier substrate 200 may be detachedfrom the semiconductor chip 120 to complete the semiconductor package100 of FIG. 1 . For example, a laser may be selective applied to theadhesive 210 in order to weaken its adhesive strength. Once the adhesivestrength of the adhesive 210 has been sufficiently weakened, the carriersubstrate 200 may be readily detached from the semiconductor chip 120without risk of damage to the semiconductor chip 120.

FIG. 8 is a cross-sectional view illustrating a semiconductor package100 a in accordance with embodiments of the inventive concept. FIG. 9 isan enlarged, cross-sectional view of portion “C” in FIG. 8 , and FIG. 10is a cross-sectional view taken along line D-D′ in FIG. 8 .

The semiconductor package 100 a of FIG. 8 may include substantially thesame elements as those described in relation to the semiconductorpackage 100 of FIG. 1 , except that the shape of the protruding sidewallis different.

Referring to FIGS. 8, 9 and 10 , the molding member 140 includes aprotruding sidewall 180 having an upper end 182, a lower end 184 and anouter side surface 186. Here, the upper end 182 of the protrudingsidewall 180 is substantially the same as the upper end 172 of theprotruding sidewall 170 described in relation to FIGS. 1, 2 and 3 .However, the lower end 184 of the protrusion 180 horizontally andoutwardly extends away from the semiconductor chip 120 at a secondvertical height well above the first vertical height associated withplane defined by the lower surface 174 of the molding member 140 and thelower surface of the semiconductor chip 120.

Thus, the vertical length of the outer side surface 186 of theprotruding sidewall 180 is substantially shorter than the outer sidesurface 176 of the protruding sidewall 170.

With his configuration, the upper end 182 of the protruding sidewall 180may again vertically offset by the distance L1 (e.g., at least about 20µm) from the upper surface of the molding member 140. However, the lowerend 184 of the protruding sidewall 180 may be further vertically offsetabove the lower surface 174 of the molding member 140 by a distance L2.In some embodiments, the second distance L2 may also be at least about20 µm, but the scope of the inventive concept is not limited thereto.

Here, the degree of horizontal and outward extension by the upper end182 of the protruding sidewall 180 may be different from (e.g., greaterthan) the degree of horizontal and outward extension of the lower end184 of the protruding sidewall 180.

FIGS. 11 to 15 are related cross-sectional vies illustrating in oneexample a method of manufacture for the semiconductor package of FIG. 8.

Referring to FIG. 11 , the molding member 140 is molded (wholly or inpart) around multiple semiconductor chips 120, and the conductive bumps130 may be arranged on the lower surface of each of the semiconductorchips 120.

A carrier substrate 200 is again attached to the upper surfaces of thesemiconductor chips 120 using the adhesive 210 in order to support thesemiconductor chips 120.

Referring to FIG. 12 , selected portions of the carrier substrate 200(along with corresponding portions of the adhesive 210) overlayingportions of the molding member 140 between adjacent ones of thesemiconductor chips 120 are removed (e.g., cut away) using the firstblade B1.

Here again as described in relation to FIG. 5 , the first blade B1 isallowed to slightly penetrate into the upper surface of the moldingmember 140 to fully and cleanly remove portions of the adhesive 210underlying the selected portions of the carrier substrate 200.

Referring to FIG. 13 , the second blade B2 is similarly applied toportions of the molding member 140 between adjacent ones of thesemiconductor chips 120, as described in relation to FIG. 6 - howeverthe second cutting process performed by the second blade B2 does notcompletely penetrate the molding member 140. Here, the second blade B2may have the second blade-width narrower than the first blade-width ofthe first blade B1, thus yielding the second cutting groove 204 having asecond width narrower than a first width of the first cutting groove 202formed by the first blade B1.

Referring to FIG. 14 , a third blade B3 may be applied to a remainingportion of the molding member 140 in second cutting groove 204 betweenthe adjacent ones of the semiconductor chips 120 to form a third cuttinggroove 206. Here, the combination of the first cutting groove 202, thesecond cutting groove 204 and finally, the third cutting groove 206effectively divides the adjacent the semiconductor chips 120 one fromthe other. However, the divided semiconductor chips 120 remain supportedby portions of the carrier substrate 200.

The third blade B3 may have a third blade-width narrower than the secondblade-width of the second blade B2. Accordingly, the third cuttinggroove 206 formed by the third blade B3 will be narrower than the secondcutting groove 204. As a result, the protruding sidewall 180 may beformed having the shape described in relation to FIGS. 8, 9 and 10 .

Alternately, after performing the second and third cutting processesusing the second blade B2 and the third blade B3, the first cuttingprocess using the first blade B1 may be performed.

Referring to FIG. 15 , the semiconductor chip 120 supported by thecarrier substrate 200 may be bonded to the package substrate 110 via theconductive bumps 130 as previously described in relation to FIG. 7 .

FIG. 16 is a cross-sectional view illustrating a semiconductor package300 according to embodiments of the inventive concept. FIG. 17 is anenlarged cross-sectional view of portion “E” in FIG. 16 , and FIG. 18 isa cross-sectional view taken along line F-F′ in FIG. 16 .

Referring to FIGS. 16, 17 and 18 , the semiconductor package 300 may bea 2.5D stack type semiconductor package that includes a packagesubstrate 310, an interposer 320, at least one first semiconductor chip330, a plurality of second semiconductor chips 340, a molding member 360and external terminals 370.

The interposer 320 may be disposed on an upper surface of the packagesubstrate 310, and be electrically connected with the package substrate310 via conductive bumps 350. Connection vias 322 may be verticallyarranged in relation to the interposer 320, wherein upper ends of theconnection vias 322 are exposed through an upper surface of theinterposer 320 and lower ends of the connection vias 322 may be exposedthrough a lower surface of the interposer 320.

The first semiconductor chip 330 may be arranged on the upper surface ofthe interposer 320. The first semiconductor chip 330 may be electricallyconnected with the interposer 320 via first conductive bumps 352. Thatis, the first semiconductor chip 330 may be electrically connected withthe upper ends of the connection vias 322 via the first conductive bumps352. The first semiconductor chip 330 may be a central processing unit(CPU), a graphic processing unit (GPU), etc.

The plurality of second semiconductor chips 340 may be verticallystacked on the upper surface of the interposer 320. In some embodiments,separate stacked pluralities of the second semiconductor chips 340 maybe arranged on opposing sides of the first semiconductor chip 330. Inthis regard, the embodiment of FIG. 16 includes a first stackedplurality of second semiconductor chips 340 and a second stackedplurality of second semiconductor chips, as one illustrative example.Here, each stacked plurality of second semiconductor chips 340 may beelectrically connected with the interposer 320 via second conductivebumps 354. That is, each stacked plurality of second semiconductor chips340 may be electrically connected with the upper ends of the connectionvias 322 via the second conductive bumps 354. The second semiconductorchips 340 may be high-bandwidth memory (HBM) chips, for example.

An underfilling layer 390 may be interposed between the packagesubstrate 110 and the interposer 320. The underfilling layer 390 may beconfigured to substantially surround each of the lower conductive bumps350 between the package substrate 310 and the interposer 320.

The external terminals 370 (e.g., solder balls or similar elements) maybe mounted on the lower surface of the package substrate 310. Here, theexternal terminals 370 may electrically contact with lower ends of theconductive patterns exposed through a lower surface of the packagesubstrate 310.

The molding member 360 (e.g., an epoxy molding compound or EMC) may bedisposed on the upper surface of the interposer 320 and may be moldedaround and in between the first semiconductor chip 330, the firststacked plurality of second semiconductor chips 340 and the secondstacked plurality of second semiconductor chips 340. In particular, themolding member 360 may be interposed between the first semiconductorchip 330 and each one of the stacked pluralities of second semiconductorchips 340, as illustrated in FIG. 18 .

Similar to the embodiment described in relation to FIGS. 8, 9 and 10 ,the molding member 360 of FIGS. 16, 17 and 18 includes a protrudingsidewall 380. The protruding sidewall 380 may include an upper end 382,a lower end 384 and an outer side surface 386. The upper end 382 of theprotruding sidewall 380 may horizontally extend outwardly away from thefirst semiconductor chip 330. The lower end 384 of the protrudingsidewall 380 may also horizontally extend outwardly away from the firstsemiconductor chip 330. The outer side surface 386 of the protrudingsidewall 380 may vertically extend between the upper ends 382 of theprotruding sidewall 380 with the lower end 384 of the protrudingsidewall 380.

Assuming a vertical height of L (e.g., that ranges from about 800 µm toabout 900 µm) between the upper surface of the package substrate 310 andthe upper surface of the molding member 360, the upper end 382 of theprotruding sidewall 380 may be vertically offset below the upper surfaceof the molding member 360 by a first distance L31 (e.g., at least about20 µm). Further, the lower end 384 of the protruding sidewall 380 may bevertically offset above the lower surface of the molding member 360 by asecond distance L32 (e.g., at least about 20 µm).

Accordingly, a vertical height (T) of the outer side surface 386 may bedetermined in accordance with the first distance L31 between the uppersurface of the molding member 360 and the upper end 382 of theprotruding sidewall 380 and the second distance L32 between the lowersurface of the molding member 360 and the lower end 384 of theprotruding sidewall 380.

It should be noted that an upper protruding width (measured in ahorizontal direction) of the upper end 382 in the protruding sidewall380 may be different (e.g., greater than) a lower protruding width(measured in the same horizontal direction) of the lower end 384 in theprotruding sidewall 380.

FIGS. 19 to 23 are related cross-sectional views illustrating in oneexample a method of manufacture for the semiconductor package of FIG. 16.

Referring to FIG. 19 , the first semiconductor chip 330 and the stackedpluralities of second semiconductor chips 340 may be arranged on theupper surface of the interposer 320. That is, the first semiconductorchip 330 and the stacked pluralities of second semiconductor chips 340may be arranged in respective package regions on the upper surface ofthe interposer 320. In these package regions, for example, stackedpluralities of second semiconductor chips 340 may be disposed onopposing sides of the first semiconductor chip 330. The lower conductivebumps 350 may be arranged on the lower surface of the interposer 320.The molding member 360 may molded around the first semiconductor chip330 and the stacked pluralities of second semiconductor chips 340.

A carrier substrate 200 may be attached to the upper surfaces of thefirst and second semiconductor chips 330 and 340 and the upper surfaceof the molding member 360 using an adhesive 210. Thus, the interposer320 and the first and second semiconductor chips 330 and 340 may besupported by the carrier substrate 200.

Referring to FIG. 20 , selected portions of the carrier substrate 200along with underlying portions of the adhesive 210 disposed overportions of the molding member 360 between the second semiconductorchips 340 may be removed (e.g., cut away) using the first blade B1. Inthis regard, the first blade B1 may be selected and used in a mannersimilar to that previously described in relation to FIG. 12 to form afirst cutting groove 202.

Referring to FIG. 21 , the second blade B2 may be selected and used tocut through the interposer 320 and a selected portion of the moldingmember 360 between adjacent, stacked pluralities of second semiconductorchips 340. Here, the second blade B2 may have a second blade-widthnarrower than a first blade-width of the first blade B1.

Thus, the second blade B2 may penetrate completely through theinterposer 320 and partially through the molding member 140 to form asecond cutting groove 204. As the second blade-width of the second bladeB2 is narrower than the first blade-width of the first blade B1, thesecond cutting groove 204 will be narrower than the first cutting groove202. Here, the interposer 320 may include different material(s) thanthose used in the molding member 360. Further, a summed verticalthicknesses of the interposer 320 and the molding member 360 may berelatively thicker than the material layer thicknesses previouslyimplicated in the previous embodiments. Accordingly, the combination ofthe interposer 320 and at least part of the molding member 360 may notbe readily cut using the second blade B2.

Referring to FIG. 22 , the third blade B3 may be used to cut a remainingportion of the molding member 360 between the adjacent stackedpluralities of the second semiconductor chips 340 in order to completelyform the third cutting groove 206. Thus, the combination of the firstcutting groove 202, the second cutting groove 204 and the third cuttinggroove 206 may be used to divide adjacent stacked pluralities of secondsemiconductor chips 340 one from the other. Using this approach,multiple package structures may be obtained, each including a cutportion of the interposer 320, the first semiconductor chip 330 and atleast one stacked plurality of second semiconductor chips 340. Hereagain, each one of the resulting package structures will be supported bythe carrier substrate 200.

As previously described, the third blade B3 may have a third blade-widthnarrower than the second blade-width of the second blade B2. Thus, thethird cutting groove 206 formed by the third blade B3 may be narrowerthan the second cutting groove 204. As a result, the molding member 360surrounding the combination of the first semiconductor chip 330 and atleast one stacked plurality of second semiconductor chips 340 willinclude the protruding sidewall 380 having the shape described above andillustrated (e.g.,) in FIG. 17 .

Alternately, after performing the second and third cutting processesrespectively using the second blade B2 and the third blade B3, the firstcutting process using the first blade B1 may be performed.

Referring to FIG. 23 , the package structure supported by the carriersubstrate 200 may be bonded to the package substrate 310 via theconductive bumps 350. Particularly, the lower conductive bumps 350 onthe lower surface of the interposer 320 may be arranged on the uppersurface of the package substrate 310. A reflow process may be performedon the conductive bumps 350, and simultaneously, the interposer 320 maybe compressed to the package substrate 310.

Noting again the possibility of warpage generated at the interposer 320during the reflow process, embodiments of the inventive concept use acut portion of the carrier substrate 200 to support the interposer 320,thereby suppressing warpage. Additionally, the risk of warpageassociated with the interposer 320 may be controlled by appropriatelyselecting a thickness of the carrier substrate 200 and/or a thickness ofthe adhesive 210.

The underfilling layer 390 may be formed between the interposer 320 andthe package substrate 310 to surround the lower conductive bumps 350with the underfilling layer 390. The external terminals 370 may bemounted on the lower surface of the package substrate 310.

The carrier substrate 200 may then be detached, as previously described,from the package structure to complete the semiconductor package 300 inFIG. 17 .

According to embodiments of the inventive concept, a carrier substratemay be attached to an upper surface of the semiconductor chip or anupper surface of the semiconductor chip over an interposer usingadhesive. The semiconductor chip or the interposer – as supported by thecarrier substrate – may then be bonded to a package substrate whilepossible material(s) warpage associated with the semiconductor chipand/or the interposer are suppressed. In this manner, the warpage of thesemiconductor chip and/or the interposer may be suppressed regardless ofthe size of the semiconductor chip or the interposer.

Additionally, warpage of the semiconductor chip and/or the interposermay be controlled by appropriately selecting a thickness of the carriersubstrate and/or a thickness of the adhesive.

The foregoing embodiments should be considered illustrative and notlimiting in nature. Although a few embodiments have been described,those skilled in the art will readily appreciate that many modificationsare possible in the embodiments without materially departing from thenovel teachings and advantages of the inventive concept. Accordingly,all such modifications are intended to fall within the scope of thefollowing claims.

What is claimed is:
 1. A method of manufacture for a semiconductor package, the method comprising: arranging at least one semiconductor chip on an upper surface of an interposer; forming a molding member on side surfaces of the at least one semiconductor chip; using an adhesive to attach a carrier substrate to an upper surface of the molding member and an upper surface of the at least one semiconductor chip; using a first blade having a first blade-width to cut away selected portions of the carrier substrate and cut away portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are disposed above portions of the molding member; using a second blade having a second blade-width narrower than the first blade-width to cut through the interposer and at least partially into a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separates a package structure including a cut portion of the interposer and the at least one semiconductor chip, collectively supported by a cut portion of the carrier substrate; and bonding the package structure to an upper surface of a package substrate.
 2. The method of claim 1, wherein arranging the at least one semiconductor chip on the upper surface of the interposer further comprises arranging a first stacked plurality of second semiconductor chips and a second stacked plurality of second semiconductor chips on the upper surface of the interposer.
 3. The method of claim 2, wherein forming the molding member further comprises forming the molding member on side surfaces of the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips.
 4. The method of claim 3, wherein attaching the carrier substrate further comprises attaching the carrier substrate to an upper surface of the first stacked plurality of second semiconductor chips and an upper surface of the second stacked plurality of second semiconductor chips.
 5. The method of claim 4, wherein the selected portions of the carrier substrate are disposed above the portions of the molding member between the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips.
 6. The method of claim 5, wherein the combination of the first cutting groove and the second cutting groove separates the package structure including the first stacked plurality of second semiconductor chips.
 7. The method of claim 1, further comprising: using a third blade having a third blade-width narrower than the second blade-width to cut through a remaining portion of the lower surface of the molding member in the second cutting groove to form a third cutting groove, wherein a combination of the first cutting groove, the second cutting groove and the third cutting groove separates the package structure.
 8. A method of manufacture for a semiconductor package, the method comprising: forming a molding member on side surfaces of semiconductor chips; using an adhesive to attach a carrier substrate to an upper surface of the molding member and an upper surface of the semiconductor chips; using a first blade having a first blade-width to cut away selected portions of the carrier substrate and portions of the adhesive underlying the selected portions of the carrier substrate, and to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between adjacent ones of the semiconductor chips; using a second blade having a second blade-width narrower than the first blade-width to cut through a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including a semiconductor chip supported by a cut portion of the carrier substrate; and bonding the package structure to an upper surface of a package substrate.
 9. The method of claim 8, wherein the carrier substrate is a glass substrate.
 10. The method of claim 8, further comprising: detaching the cut portion of the carrier substrate from the semiconductor chip by irradiating the adhesive with a laser to weaken an adhesive strength of the adhesive.
 11. A method of manufacture for a semiconductor package, the method comprising: arranging a first semiconductor chip, a first stacked plurality of second semiconductor chips and a second stacked plurality of second semiconductor chips on an upper surface of an interposer; forming a molding member on side surfaces of the first semiconductor chip, the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips; using a first blade having a first blade-width to partially cut into an upper surface of the molding member to form a first cutting groove; using a second blade having a second blade-width narrower than the first blade-width to cut through the interposer and at least partially into a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separates a package structure including a cut portion of the interposer, the first semiconductor chip and the first stacked plurality of second semiconductor chips; and bonding the package structure to an upper surface of a package substrate.
 12. The method of claim 11, further comprising using an adhesive to attach a carrier substrate to the upper surface of the molding member, an upper surface of the first semiconductor chip, an upper surface of the first stacked plurality of second semiconductor chips and an upper surface of the second stacked plurality of second semiconductor chips.
 13. The method of claim 12, wherein the carrier substrate is a glass substrate.
 14. The method of claim 12, further comprising using the first blade to cut away selected portions of the carrier substrate and cut away portions of the adhesive underlying the selected portions of the carrier substrate, wherein the selected portions of the carrier substrate are disposed above portions of the molding member.
 15. The method of claim 11, further comprising: using a third blade having a third blade-width narrower than the second blade-width to cut through a remaining portion of the lower surface of the molding member in the second cutting groove to form a third cutting groove, wherein a combination of the first cutting groove, the second cutting groove and the third cutting groove separates the package structure.
 16. A method of manufacture for a semiconductor package, the method comprising: providing a first semiconductor chip, a first stacked plurality of second semiconductor chips and a second stacked plurality of second semiconductor chips; forming a molding member on side surfaces of the first semiconductor chip, the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips; using an adhesive to attach a carrier substrate to an upper surface of the molding member, an upper surface of the first semiconductor chip, an upper surface of the first stacked plurality of second semiconductor chips and an upper surface of the second stacked plurality of second semiconductor chips; using a first blade having a first blade-width to cut away selected portions of the carrier substrate and cut away portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips; using a second blade having a second blade-width narrower than the first blade-width to cut through an interposer and at least partially into a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including the first semiconductor chip and the first stacked plurality of second semiconductor chips, collectively supported by a cut portion of the carrier substrate; and bonding the package structure to an upper surface of a package substrate.
 17. The method of claim 16, wherein providing the first semiconductor chip, the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips comprises arranging the first semiconductor chip, the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips on an upper surface of the interposer.
 18. The method of claim 17, wherein the package structure further comprises a cut portion of the interposer.
 19. The method of claim 16, wherein the carrier substrate is a glass substrate.
 20. The method of claim 16, further comprising: using a third blade having a third blade-width narrower than the second blade-width to cut through a remaining portion of the lower surface of the molding member in the second cutting groove to form a third cutting groove, wherein a combination of the first cutting groove, the second cutting groove and the third cutting groove separates the package structure. 